Cover of an electronic device having surface ornamentation



The present application is related to copending U.S. patent applicationSer. Nos. 29/417,685, 29/417,686, 29/417,687, 29/417,688, each entitled“Cover of an Electronic Device Having Surface Ornamentation”, by Bin Li.These applications have the same assignee as the present application andhave been concurrently filed herewith. The above-identified applicationsare incorporated herein by reference.

FIG. 1 is a perspective view of a cover of an electronic device havingsurface ornamentation showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a side elevational view thereof; and,

FIG. 4 is an enlarged fragmentary view thereof showing circled portion 4in FIG. 2.

In FIGS. 1-3, the evenly segmented broken lines indicate portions of thecover of an electronic device having surface ornamentation that form nopart of the claimed design. In FIGS. 2 and 4, the unevenly segmentedbroken lines indicate the portion of the design that is shown on anenlarged scale in FIG. 4. The broken lines form no part of the claimeddesign.

The ornamental design for a cover of an electronic device having surfaceornamentation, as shown and described.